Nanostructured Copper Interfaces for Enhanced Boiling
On the boil: Nanostructured Cu interfaces display enhanced boiling performance at low superheated temperatures compared to untreated Cu, caused by a large increase in the density of active bubble nucleation sites. The enhancement is caused by nanobubbles, which percolate through the interconnected network of nanopores and enable stable nucleation of bubbles at microscale cavities (defects) on the film surface (see picture). Supporting information for this article is available on the WWW under http://www.wiley-vch.de/contents/jc_2296/2008/smll200700991_s.pdf or from the author. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.